Charles Edward Industries
Charles Edward Industries
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    • Home
    • About Us
    • Services
    • Quality
    • Employment
    • Contact Us

  • Home
  • About Us
  • Services
  • Quality
  • Employment
  • Contact Us

CEI Quality

Quality Policy

CEI is committed to providing the highest quality level of products and services and will pursue continuous improvement in all areas to achieve total Customer Satisfaction. 

ITAR Registered Company

ISO 9001

Compliant Standards

ANSI/ESD S20.20

Protection of Electrical and Electronic Part, Assemblies and Equipment

IPC-2221

Generic Standard on Printed Board Design

IPC-7095

Design and Assembly Process Implementation for BGAs


IPC-7351

Generic Requirements for Surface Mount Design and Land Pattern Standard

IPC-7711/7721

Rework of Electronic Assemblies; Repair and Modification of Print Boards and Electronic Assemblies

IPC-9151

Printed Board Process Capability, Quality, and Relative Reliability Benchmark Test Standard and Database


IPC-9191

General Guidelines for Implementation of Statistical Process Control (SPC)


IPC-9261

In-Process DPMO and Estimated Yield for PWAs


IPC-9850

Surface Mount Placement Equipment Characterization

IPC-A-600

Acceptability of Printed Boards

IPC-A-620

Requirements and Acceptance for Cable and Wire Harness Assemblies

IPC-HDBK-830

Guidelines for Design, Selection and Application of Conformal Coatings

IPC-S-816

SMT Process Guideline and Checklist

IPC-SA-61

Post Solder Semiaqueous Cleaning Handbook

IPC-TM-650, 2.3.25.1

Test Method Manual, Ionic Cleaning Testing of Bare Boards

IPC-TM-650, 2.4.22

Test Method Manual, Bow and Twist (Percentage)


IPC-TM-650, 2.4.28.1

Test Method Manual, Solder Mask Adhesion - Tape Test Method


J-STD-001

Requirements for Soldered Electrical and Electronic Assemblies

J-STD-002

Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires


J-STD-003

Solderability Test for Printed Boards


J-STD-004

Requirements for Soldering Fluxes


J-STD-005

Requirements for Soldering Pastes


J-STD-006

Requirements for Electronics Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications


J-STD-020

Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices


J-STD-033

Handling, Packaging, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices


MIL-STD-105

Sampling Procedure and Tables for Inspection by Attributes



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