CEI Quality
Quality Policy
CEI is committed to providing the highest quality level of products and services and will pursue continuous improvement in all areas to achieve total Customer Satisfaction.
ITAR Registered Company
ISO 9001
Compliant Standards
ANSI/ESD S20.20
Protection of Electrical and Electronic Part, Assemblies and Equipment
IPC-2221
Generic Standard on Printed Board Design
IPC-7095
Design and Assembly Process Implementation for BGAs
IPC-7351
Generic Requirements for Surface Mount Design and Land Pattern Standard
IPC-7711/7721
Rework of Electronic Assemblies; Repair and Modification of Print Boards and Electronic Assemblies
IPC-9151
Printed Board Process Capability, Quality, and Relative Reliability Benchmark Test Standard and Database
IPC-9191
General Guidelines for Implementation of Statistical Process Control (SPC)
IPC-9261
In-Process DPMO and Estimated Yield for PWAs
IPC-9850
Surface Mount Placement Equipment Characterization
IPC-A-600
Acceptability of Printed Boards
IPC-A-620
Requirements and Acceptance for Cable and Wire Harness Assemblies
IPC-HDBK-830
Guidelines for Design, Selection and Application of Conformal Coatings
IPC-S-816
SMT Process Guideline and Checklist
IPC-SA-61
Post Solder Semiaqueous Cleaning Handbook
IPC-TM-650, 2.3.25.1
Test Method Manual, Ionic Cleaning Testing of Bare Boards
IPC-TM-650, 2.4.22
Test Method Manual, Bow and Twist (Percentage)
IPC-TM-650, 2.4.28.1
Test Method Manual, Solder Mask Adhesion - Tape Test Method
J-STD-001
Requirements for Soldered Electrical and Electronic Assemblies
J-STD-002
Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
J-STD-003
Solderability Test for Printed Boards
J-STD-004
Requirements for Soldering Fluxes
J-STD-005
Requirements for Soldering Pastes
J-STD-006
Requirements for Electronics Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
J-STD-020
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
J-STD-033
Handling, Packaging, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
MIL-STD-105
Sampling Procedure and Tables for Inspection by Attributes
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